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參數資料
| 型號： | ISL58328CIZ-T7 |
| 廠商： | Intersil |
| 文件頁數： | 3/14頁 |
| 文件大小： | 380K |
| 描述： | IC LASER PWR MONITOR 5V 9CSP |
| 標準包裝： | 1 |
| 傳感器類型： | 光學 |
| 輸出類型： | 電壓 |
| 其它名稱： | ISL58328CIZ-T7DKR ISL58328CIZ-T7TRDKR ISL58328CIZ-T7TRDKR-ND |
ISL58328
3
FN6329.2
July 29, 2013
Pin Configuration
ISL58328
(9 BALL OCSP)
TOP VIEW
3
2
1
B
A
C
VDD
OUTN
OUTP
VSS
HL
VREF
SEN
SCLK
SDATA
PD
Pin Descriptions
PIN NUMBER
PIN NAME
TYPE
DESCRIPTION
A1
SDATA
Digital I/O
Serial interface data, bi-directional
B1
VREF
Analog Input
Reference voltage input
C1
OUTP
Analog Output
Positive swing analog output
A2
SCLK
Digital Input
Serial interface clock
B2
HL
Digital Input
HIGH/LOW gain mode selection, H = High gain, L = Low Gain.
Use in conjunction with Reg 0x10 bit 7.
* For hardware switching, Reg 0x10 bit 7 must be set to 1.
* For soft switching, this pin must be High.
C2
OUTN
Analog Output
Negative swing analog output
A3
SEN
Digital Input
Serial interface enable
B3
VSS
Power
GND
C3
VDD
Power
+5.0V supply
PD
Optical input
Photo Diode
Ordering Information
PART NUMBER
(Notes 1, 2, 3, 4)
PART
MARKING
PACKAGE
Tape & Reel
(Pb-free)
PKG.
DWG. #
ISL58328CIZ-T7
123Z (Backside of Die)
9 Ball OCSP
S3x3.9
ISL58328CIZ-T7A
123Z (Backside of Die)
9 Ball OCSP
S3x3.9
ISL58328CIZ-EVAL
Evaluation Board
NOTES:
1. Please refer to TB347
for details on reel specifications.
2. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material sets; molding compounds/die attach materials and
SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free
WLCSP and BGA packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3. Please refer to TB478
for solder profile.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL58328
. For more information on MSL please see tech brief TB363
.
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