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參數資料
| 型號： | MC74LCX74DT |
| 廠商： | MOTOROLA INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | LOW-VOLTAGE CMOS DUAL D-TYPE FLIP-FLOP |
| 中文描述： | LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 |
| 封裝： | PLASTIC, TSSOP-14 |
| 文件頁數： | 7/9頁 |
| 文件大小： | 145K |
| 代理商： | MC74LCX74DT |
MC74LCX74
LCX DATA
BR1339 — REV 3
7
MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
–B
–
P
7 PL
G
C
K
SEATING
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
Z
D
HE
E
1
14
8
7
b
A1
A
e
L
DIM
A
MIN
---
0.05
0.35
0.18
9.90
5.10
1.27 BSC
7.40
0.50
1.10
0
0.70
---
MAX
2.05
0.20
0.50
0.27
10.50
5.45
MIN
---
0.002
0.014
0.007
0.390
0.201
0.050 BSC
0.291
0.020
0.043
0
MAX
0.081
0.008
0.020
0.011
0.413
0.215
INCHES
MILLIMETERS
8.20
0.85
1.50
10
0.323
0.033
0.059
10
0.90
1.42
0.028
---
0.035
0.056
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
LE
Q1
c
M
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
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相關代理商/技術參數 |
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| MC74LCX74DTG | 功能描述:觸發器 2-3.6V CMOS Dual D-Type RoHS:否 制造商:Texas Instruments 電路數量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74LCX74DTR2 | 功能描述:觸發器 2-3.6V CMOS Dual RoHS:否 制造商:Texas Instruments 電路數量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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| MC74LCX74DTR2G-CUT TAPE | 制造商:ON 功能描述:MC74LCX74 Series 2.3 to 3.6 V CMOS Dual D-Type Flip-Flop - TSSOP-14 |
| MC74LCX74DTR2H | 制造商:Rochester Electronics LLC 功能描述: 制造商:ON Semiconductor 功能描述: |
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