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參數(shù)資料
| 型號(hào)： | MCM32257BZ20 |
| 廠商： | MOTOROLA INC |
| 元件分類： | DRAM |
| 英文描述： | 256K x 32 Bit Fast Static RAM Module |
| 中文描述： | 1M X 8 MULTI DEVICE SRAM MODULE, 20 ns, ZMA64 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大?。?/td> | 158K |
| 代理商： | MCM32257BZ20 |
MCM32257B
6–1
Motorola, Inc. 1995
256K x 32 Bit
Fast Static RAM Module
The MCM32257B is an 8M bit static random access memory module orga-
nized as 262,144 words of 32 bits. The module is a 64–lead zig–zag in–line pack-
age (ZIP) of eight MCM6229 fast static RAMs packaged in 28–lead SOJ
packages and mounted on a printed circuit board along with eight decoupling ca-
pacitors.
The MCM6229 is a high–performance CMOS fast static RAM organized as
262,144 words of 4 bits, fabricated using high–performance silicon–gate CMOS
technology. Static design eliminates the need for external clocks or timing
strobes, while CMOS circuitry reduces power consumption and provides for
greater reliability.
The MCM32257B is equipped with output enable (G
)
and four separate byte
enable (E1 – E4) inputs, allowing for greater system flexibility. The G input, when
high, will force the outputs to high impedance. Ex high will do the same for byte x.
PD0 and PD1 are reserved for density identification. PD0 and PD1 are con-
nected to ground. These pins can be used to identify the density of the memory
module.
Single 5 V
±
10% Power Supply
Fast Access Time: 15/20/25 ns
Three–State Outputs
Fully TTL Compatible
JEDEC Standard Pinout
Power Requirement: 960/880/840 mA Maximum, Active AC
High Board Density ZIP Package
Byte Operation: Four Separate Chip Enables, One for Each Byte (Eight Bits)
High Quality Four–Layer FR4 PWB with Separate Internal Power and
Ground Planes
Incorporates Motorola’s State–of–the–Art Fast Static RAMs
A0 – A17
W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
G
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
E1 – E4
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DQ0 – DQ31
. . . . . . . . . . . . . . . . . . . . . .
VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . .
VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PD0 – PD1
. . . . . . . . . . . . . . . . . . . . . . . .
Address Inputs
Write Enable
Output Enable
Byte Enables
Data Input/Output
+ 5 V Power Supply
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Ground
Package Density
For proper operation of the device, VSS must be connected
to ground.
PIN NAMES
Order this document
by MCM32257B/D
SEMICONDUCTOR TECHNICAL DATA
MCM32257B
PD0
2
A15
52
DQ1
DQ2
DQ3
VCC
A1
A3
A5
DQ4
DQ5
DQ6
DQ7
W
A7
E1
VSS
PD1
DQ8
DQ9
DQ10
A0
A2
A4
DQ12
DQ13
DQ14
DQ15
VSS
A6
E2
DQ11
E4
A8
DQ24
A10
A12
A14
G
DQ25
DQ27
E3
A9
VSS
DQ16
DQ17
DQ18
DQ19
A11
A13
43
DQ26
19
21
23
25
27
29
1
3
5
7
9
11
13
15
17
20
22
24
26
28
30
32
4
6
8
10
12
14
16
18
45
47
49
51
31
33
35
37
39
41
46
48
50
34
36
38
40
42
44
A16
DQ20
DQ21
DQ22
DQ23
VSS
62
64
54
56
58
60
61
63
53
55
57
59
VCC
A17
DQ28
DQ29
DQ31
DQ30
PIN ASSIGNMENT
TOP VIEW
64 LEAD ZIP — CASE 871–01
DQ0
5/95
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