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參數資料
| 型號： | MC74HC7266A |
| 廠商： | Motorola, Inc. |
| 英文描述： | SMPS Controller; Package: SOIC; No of Pins: 8; Container: Tape & Reel |
| 中文描述： | 四2輸入異或非門 |
| 文件頁數： | 5/6頁 |
| 文件大小： | 137K |
| 代理商： | MC74HC7266A |
MC74HC7266A
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5
MOTOROLA
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.300 BSC
0
0.015
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.62 BSC
0
0.39
0.095
0.015
0.135
2.41
0.38
3.43
10
10
1.01
0.039
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MC74HC7266AD | 制造商:ON Semiconductor 功能描述: |
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| MC74HC7266AFEL | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC7266AFR1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC7266N | 制造商:Motorola Inc 功能描述: |
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